Xudong Jiang received the B.Eng. and M.Eng. from the University of Electronic Science and Technology of China (UESTC), and the Ph.D. degree from Helmut Schmidt University, Hamburg, Germany. From 1986 to 1993, he was a Lecturer with UESTC, where he received two Science and Technology Awards from the Ministry for Electronic Industry of China. From 1998 to 2004, he was with the Institute for Infocomm Research, A-Star, Singapore, as a Lead Scientist and the Head of the Biometrics Laboratory, where he developed a system that achieved the most efficiency and the second most accuracy at the International Fingerprint Verification Competition in 2000. He joined Nanyang Technological University (NTU), Singapore, as a Faculty Member, in 2004, and served as the Director of the Centre for Information Security from 2005 to 2011. Currently, he is a professor in NTU. Dr Jiang holds 7 patents and has authored over 200 papers with 2 papers in Nature Communications, 20 papers in Pattern Recognition and over 40+ papers in the IEEE journals, including 6 papers in IEEE Transactions on Pattern Analysis and Machine Intelligence and 14 papers in IEEE Transactions on Image Processing. Four of his papers have been listed as the top 1% highly cited papers in the academic field of Engineering by Essential Science Indicators. He served as IFS TC Member of the IEEE Signal Processing Society from 2015 to 2017, Associate Editor for IEEE Signal Processing Letter from 2014 to 2018, Associate Editor for IEEE Transactions on Image Processing from 2016 to 2020 and the founding editorial board member for IET Biometrics form 2012 to 2019. Dr Jiang is currently an IEEE Fellow and serves as Senior Area Editor for IEEE Transactions on Image Processing and Editor-in-Chief for IET Biometrics. His current research interests include image processing, pattern recognition, computer vision, machine learning, and biometrics.
Cheng, Yuhua received the BSEE, MSEE, and Ph.D. EE degrees in Shandong Polytechnic University (Now Shandong University), Tianjin University, and Tsinghua University, China in 1982, 1985 and 1989, respectively. In 1990, he joined in the Institute of Microelectronics (IME), Peking University, China. From 1992 to 1996, he was an associate professor in IME. He is now with Peking University, as a full professor.
Dr. Cheng has served on many Technical Program Committees and chaired numerous Sub-committees at international conferences, including the IEEE Custom Integrated Circuits Conference (CICC) (from 2002 to 2005) and Radio Frequency Integrated Circuits Symposium (since 2002). He organized and participated in numerous workshops and panels related to RFCMOS technology and SoC design. He has authored and co-authored over 160 research papers, two book chapters, two books “MOSFET Modeling & BSIM3 User’s Guide” by Kluwer Academic Publishers (1999), and “Device modeling for analog/RF circuit design” by John Wiley and Sons (2002). He was a Guest Editor for IEEE Journal of Solid-State Circuits. He is an IEEE Fellow and a member of both Electronic Device Society (EDS) and Solid-state Circuit Society (SSCS). His research interests include smart power discrete semiconductor devices and advanced analog/mixed-signal/RF integrated circuits for system integration applications.
Dr.Cheng was the principal developer to BSIM3v3 (Yuhua Cheng, et al., BSIM3v3 User's Manual, UC Berkeley, UCB/ERL M97/2, 1997). Due to Dr. Cheng’s efforts, the discontinuity problems, considered as a major shortcoming in BSIM models, were resolved in BSIM3v3, while many new physical effects were implemented. BSIM3v3 has been used worldwide by foundries and design companies for IC simulation. It was selected as the first MOSFET model for compact model standardization effort for IC simulation by Electronics Industry Association/Compact Model Council and given an R&D 100 Award in 1996.
Since 2006, Dr. Cheng has been conducting research on ESD for more than 10 years, which has made significant achievements, which resulted in more than 30 research papers. He shared with the IC industry his research results in international conferences and journals including IEEE Journal of Solid-state Circuits, IEEE Trans. On Electron Devices, and IEEE Electron Devices Letters.